Boeing and Motorola Solutions Foundation will host STEM Signing Day 2019 in Chicago this spring. All high school students enrolling in a post-secondary school are welcome to apply. Students must complete the below application, detailing their academic and after-school experiences, personal goals and aspirations to pursue a STEM-related major and career pathway. The goal is to celebrate the accomplishments of students who are currently underrepresented in STEM fields
STEM Signing Day 2019 Application
Please review the following to prepare your application submission.
The STEM Signing Day 2019 application has four categories; Personal Story, Academic/After-School Experience, Career Interest, and a Bonus question. Applicants should take time to review the questions and prepare a well-developed response. Please take advantage of the word count limits.
- A completed application.
- An Acceptance letter to a post-secondary institution, this includes community/junior college or accredited certification program.
- A reference letter from a teacher, counselor or after-school program instructor.
- Applicants will need to indicate the aldermanic ward in which they reside.
Please find the application questions for your review. All submissions must be entered into the application to be reviewed.
Write a short autobiography that talks about your family, school, community involvement, hobbies, spare time activities, and what you hope to do in the future. 500 words max
How will you make a difference in our world? 200 words max
Please provide a brief description of an experience, class, activity or role model that inspired your STEM interest. 500 words max
What after-school programs exposed you to your career interest? What was the impact of the program? 250 words max
What is your career interest? Provide a personal experience or activity that influenced your decision. 250 words max
What STEM related field do you intend on pursuing as your college major? Describe how this major will lead you to your career path. 100 words max